DenseChip services

End-to-end custom chip design—you focus on the product

Tell us what you need built. We run the full silicon journey—architecture through tape-out—while you stay involved at the milestones that matter.

Service phases

What we deliver

A clear sequence from idea to silicon—you approve each gate before we move on.

  1. Specification & architecture

    Capture your requirements, interfaces, and constraints. We define the micro-architecture, clocking, and power targets with you.

  2. RTL design

    RTL development in Verilog/SystemVerilog—datapath, control, memories, and integration of IPs you approve.

  3. Verification

    UVM/SV testbenches, coverage plans, assertions, and regression flows until sign-off criteria are met.

  4. Synthesis & timing

    Logic synthesis, constraints, STA closure, and handoff quality checks before physical design.

  5. Physical design

    Floorplan, placement, routing, CTS, and power integrity—aligned to your PDK and foundry rules.

  6. Signoff & tape-out

    DRC, LVS, IR drop, and final GDS review. We coordinate tape-out readiness with your foundry partner.

  7. Bring-up support

    Post-silicon debug guidance, lab bring-up checklists, and iteration planning for respins if needed.

How we work together

You provide

  • Product requirements and success criteria
  • Target PDK, foundry, and package preferences
  • Any mandatory third-party IP licenses
  • Review milestones and sign-off authority

We handle

  • End-to-end execution across design, DV, and implementation
  • Weekly status, risk register, and milestone deliverables
  • Tooling, flows, and engineering team allocation
  • Documentation for handoff to manufacturing partners

Have a block or full SoC in mind?

Share your timeline, technology node, and goals—we will outline a phased proposal and engagement model.