Use these drills after completing all topics in Package & Interface. Answer with baseline, boundary, owner, metric, artifact, and regression scope.
[INT][SOC][PACKAGE-INTERFACE]
Q: Why is bump planning an early architecture topic?
A:
Because escape routability, SI/PI margin, and power delivery limits are set before detailed implementation.
FOLLOW-UP TRAP: Deferring bump decisions to the final floorplan phase.[INT][SOC][PACKAGE-INTERFACE]
Q: What is a common package-model escape?
A:
Using stale SI/PI package models that no longer match routing revisions.
FOLLOW-UP TRAP: Assuming model version is implied by date.[INT][SOC][PACKAGE-INTERFACE]
Q: How do you separate package from firmware root cause quickly?
A:
Correlate electrical/link signatures with deterministic firmware sequences on the same baseline manifest.
FOLLOW-UP TRAP: Alternating hardware and software guesses without shared evidence.BASELINE -> OWNER -> CONTRACT -> METRIC -> FIX -> REGRESSIONPACKAGE CO-DESIGN
die io <-> package routing <-> board constraintsState baseline manifest and owner with every closure metric.
Run cross-domain regression after every top-level fix.
Comparing results across different manifests.
Unowned issues slipping through review cycles.
Waiving risks without expiry and validation plan.