Chip-Package I/O Co-design: Review Checklist

Review checklist

Review Checklist for Chip-Package I/O Co-design focuses on I/O timing closure against package constraints. The goal is to map symptoms to boundary contracts, owner actions, and regression-proof closure.

• Baseline manifest and revision are explicit.

• Boundary contracts for this topic are current and approved.

• Ownership map covers all open issues.

• Focused and full regression evidence both exist.

• Residual risks are either closed or bounded via waiver policy.

• Owners signed: I/O architect, package lead, board owner.

Signoff ownership

OWNERSHIP MAP — Chip-Package I/O Co-design

artifact             owner
-----------------    -----------------
primary owner     I/O architect
co-owner          package lead
review owner      board owner

No top-level issue should remain ownerless beyond one review cycle.

SoC deep dive

Package assumptions must be treated as first-class chip constraints.

Concept diagram

PACKAGE CO-DESIGN
die io <-> package routing <-> board constraints

Metric graph

PACKAGE RISK MIX
SI margin █████
power integrity ████
lane mapping ███

Reports and artifacts

• bump map revision log

• SI/PI margin report

• IO co-design checklist

• package bring-up failures

Mini case study

Link degradation on product board came from package routing assumptions not reflected in pre-silicon model.

Debug branches

• Compare package model versions

• Audit lane mapping

• Correlate SI/PI margins to failures

Senior review question

Ask: what baseline, owner, and artifact prove this topic is truly closed?

Key takeaways

• State baseline manifest and owner with every closure metric.

• Run cross-domain regression after every top-level fix.

Common pitfalls

• Comparing results across different manifests.

• Unowned issues slipping through review cycles.

• Waiving risks without expiry and validation plan.

Principal SoC review addendum

I/O co-design aligns pad-ring, bump assignment, voltage domains, ESD, and board routing expectations as a single contract.

Metric: I/O timing closure against package constraints