CPU Design · All levels

Core Array Floorplanning: Inputs and Outputs

Inputs and Outputs for Core Array Floorplanning.

Inputs and outputs contract

Inputs and Outputs for Core Array Floorplanning centers on wirelength congestion index, macro adjacency quality, and frequency headroom. Tie every claim to a measurable artifact and an owner-controlled action.

diagram
INPUTS
  - workload definition and target KPI
  - binary/compile flags/runtime/firmware metadata
  - microarchitecture and silicon assumptions
  - correctness and regression gates

OUTPUTS
  - evidence-backed bottleneck classification
  - owner-signed fix proposal
  - validation matrix with rollback thresholds

Ownership split

diagram
CPU OWNERSHIP LAYERS - Core Array Floorplanning

artifact area     owner
----------------  ----------------------------
architecture    physical design lead
RTL/microarch   CPU architect
software/tools  implementation owner

Rule: every regressed metric must map to an explicit owner and closure artifact.

CPU deep dive

Physical closure and observability planning determine whether CPU architecture wins survive first silicon.

Concept diagram

diagram
CPU SILICON CLOSURE

core/LLC floorplan -> clock/power domains -> PMCs/observability -> bring-up

Metric graph

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CLOSURE RISK MIX

timing margin risk   █████
thermal hotspots     ████
bring-up blockers    ███

Reports and artifacts

  • floorplan congestion map

  • timing closure summary

  • IR/thermal transient report

  • bring-up milestone tracker

Mini case study

A floorplan change improved routing congestion but created thermal clustering that forced frequency throttling in sustained tests.

Debug branches

  • Trace critical paths to physical regions and domain crossings

  • Run dynamic IR and thermal checks on burst workloads

  • Use PMCs and bring-up logs to correlate silicon symptoms to design intent

Senior review question

Ask: which CPI/latency evidence proves this topic is truly closed beyond synthetic benchmarks?

Key takeaways

  • Always connect microarchitectural counter changes to product workload outcomes.

  • Lock binary, compiler, firmware, and thermal metadata before comparing CPU traces.

Common pitfalls

  • Treating average IPC as sufficient proof while ignoring latency tails and outliers.

  • Applying predictor or prefetch tweaks without first-failing-stage attribution.

  • Declaring closure without reproducible perf, correctness, and power gates.

Handoff explanation

Inputs are broader than knob settings. CPU analysis inputs include workload mix, branch entropy, memory footprint, compiler revision, OS affinity policy, DVFS state, thermal envelope, and stepping.

Outputs must support action: wirelength congestion index, macro adjacency quality, and frequency headroom, artifact packet (floorplan snapshot, congestion heatmap, and timing path locality report), bottleneck class, owner, expected effect, and rollback scope. "Performance improved" without this packet is not closure-ready.

The safest handoff is before/after evidence: environment tags, counters, traces, hypothesis, chosen change, rejected alternatives, and regression criteria.