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Course contents

  • How to Use This Course
  • The NanoSoC Tour
  • Reading Path
  • SoC Glossary10
  • SoC Metrics Reference
  • SoC Cheatsheet
  • What SoC Integration Is12
  • Architecture and Budgets21
  • Memory Maps and Address Decode26
  • Interconnect and Bus Fabrics26
  • Clock and Reset Architecture24
  • Power Architecture21
  • Interrupts, DMA and Peripherals15
  • Memories, Boot and Security21
  • IP Integration and Handoff21
  • Top-Level Verification and Bring-up21
  • Package, Pads and I/O18
    • I/O Ring and Pad Types
    • Pad Count and Simultaneous Switching
    • Package and Ballout
    • Power Delivery Through Package and Bumps
    • ESD and Latch-Up at the Top
      • What the Integrator Checks
      • Cross-Domain Discharge Paths
      • Pad-to-Core Interfaces and Latch-Up
    • Test and Debug Pins (extension)
  • Chip Signoff and Tapeout18
  • SoC Interview Prep16
  • Capstone: Integrate NanoSoC14
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←Package, Pads and I/O
  1. Topics
  2. SoC Design
  3. Package, Pads and I/O
  4. ESD and Latch-Up at the Top

Part 11 of 14Part 11 of 14/Package, Pads and I/OAll levels

ESD and Latch-Up at the Top

What the integrator checks, cross-domain discharge paths, and pad-to-core interfaces; conceptual throughout.

  • 3topics
  • 3lessons

A discharge event does not consult the functional specification: thousands of volts arrive at one pin and must leave through a designed path, or they leave through the nearest transistor. The protection devices themselves belong to the library and physical design teams, and this topic designs none of them. What belongs to the integrator is the top-level view: that every pin has a path, that the paths connect across supply domains and across power states, and that the pad-to-core boundary cannot latch. NanoSoC's protection is all on the die: a diode pair at each of its 19 signal pads and a rail clamp in each of its 6 supply pad cells. The package has none. Three short lessons state exactly what to check and what to ask for.

Lesson

After it you can...

What the Integrator Checks

Run the NanoSoC protection checklist on the pad ring and name the evidence each item needs.

Cross-Domain Discharge Paths

Trace a discharge in four power states, starting from all rails off, without a dead end.

Pad-to-Core Interfaces and Latch-Up

State the latch-up review questions for every pad-to-core boundary.

Suggested order: top to bottom. The checklist first, because it names the parts; then the paths between the parts; then the latch-up boundary the paths must not create. For the implementation behind every item see ESD and IO Ring Integration, and for its checks IO Ring Checks.

Check yourself Why does protection get a topic if the integrator designs no protection device?

Because completeness is an integration property: a perfect clamp on every pin still fails if the rails do not close through the corners, or if a path dies in a power state nobody walked. The integrator checks the whole, not the parts.

If asked about ESD, answer as an integrator: every pin has a path, paths close into loops, loops work in every power state including unpowered. Device physics belongs to another interview.

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See also

  • I/O Ring and Pad Types
  • Pad Count and Simultaneous Switching
  • Package and Ballout