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Course contents

  • How to Use This Course
  • The NanoSoC Tour
  • Reading Path
  • SoC Glossary10
  • SoC Metrics Reference
  • SoC Cheatsheet
  • What SoC Integration Is12
  • Architecture and Budgets21
  • Memory Maps and Address Decode26
  • Interconnect and Bus Fabrics26
  • Clock and Reset Architecture24
  • Power Architecture21
  • Interrupts, DMA and Peripherals15
  • Memories, Boot and Security21
  • IP Integration and Handoff21
  • Top-Level Verification and Bring-up21
  • Package, Pads and I/O18
    • I/O Ring and Pad Types
      • Pad Types: Digital, Analog and Supply
      • The I/O Ring
      • Pad Function, Drive and Reset State
    • Pad Count and Simultaneous Switching
    • Package and Ballout
    • Power Delivery Through Package and Bumps
    • ESD and Latch-Up at the Top
    • Test and Debug Pins (extension)
  • Chip Signoff and Tapeout18
  • SoC Interview Prep16
  • Capstone: Integrate NanoSoC14
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←Package, Pads and I/O
  1. Topics
  2. SoC Design
  3. Package, Pads and I/O
  4. I/O Ring and Pad Types

Part 11 of 14Part 11 of 14/Package, Pads and I/OAll levels

I/O Ring and Pad Types

Pad types, the ring that holds them, and the function and drive options on every pin.

  • 3topics
  • 3lessons

Every signal on NanoSoC crosses the same boundary: core logic, a pad cell, a bond wire, the package, the board. The pad cell is where the integrator's choices live — what kind of cell, what it drives, what holds it while the chip is in reset — and those choices are made per pin in a table, never by accident in a netlist. This topic builds that table: the three pad families, the ring that arranges 31 pads around the die, and the function, pull and drive options inside each cell. Its companions in this section count the pads, place them on balls, feed them power and protect them; the physical construction of the ring belongs to the physical design course.

Lesson

After it you can...

Pad Types: Digital, Analog and Supply

List every NanoSoC pad by family and say why each signal takes its type.

The I/O Ring

Read the 8, 8, 8 and 7 pad ring and check that each side carries supplies and the crystal stays quiet.

Pad Function, Drive and Reset State

Choose pull and drive per pin and check the reset-state table, including the pad cell's own power-on control.

Suggested order: top to bottom. Types first, because the ring is arranged around which pads need which supplies; then the ring; then the per-pin options, which assume both. The pad-count topic next door consumes the inventory the first lesson produces.

Check yourself Why must the pad inventory exist before the package ballout can be drawn?

Because the ballout assigns every pad: each signal pad needs a ball with a routable escape, each supply pad needs a ball close to the pad that feeds the die, and analog pads need quiet neighbours. Without the inventory there is nothing to assign.

Expect to classify any pin into digital, analog or supply and defend the choice, then say what its pad does while the chip sits in reset.

PreviousNext: Pad Types: Digital, Analog and Supply

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See also

  • Pad Count and Simultaneous Switching
  • Package and Ballout
  • Power Delivery Through Package and Bumps