Inputs & Outputs for Memory Repair Flow focuses on repairable fail ratio, spare utilization, post-repair yield uplift. The goal is to convert metric movement into mechanism, owner, and release decision.
Treat these as a release contract. Ambiguity here creates expensive debug loops because teams optimize against different assumptions.
INPUTS
- scan/ATPG architecture and constraints
- fault model and quality target policy
- pattern generation config + tester limits
- timing/power/physical assumptions
OUTPUTS
- quality metrics and closure status
- signed artifacts and owner approvals
- diagnosis evidence for residual risk
- release, waiver, or escalation decisionDFT FLOW - Memory Repair Flow
scan insertion -> chain stitch -> compression map -> ATPG -> tester apply -> diagnosis
| | | | |
controllability shift balance channel use coverage silicon correlation
Primary metric: repairable fail ratio, spare utilization, post-repair yield upliftOWNERSHIP MAP - Memory Repair Flow
artifact owner
---------------- -----------------
architecture/report memory test owner
constraints/setup yield owner
physical/test DFT lead
Name an owner for each failing metric cluster.BIST value is realized only when insertion, diagnosis, and repair are tied to production flow.
BIST FLOW
insert MBIST/LBIST -> execute -> collect signatures -> diagnose/repair -> signoffREPAIR EFFECT
yield
^
| o pre-repair
| o post-repair
+---------------------> lotMBIST insertion coverage
repair signature report
LBIST resistant fault list
BIST release checklist
Fuse programming mismatch blocked repair activation; corrected bring-up script recovered expected yield uplift.
Validate BIST reachability
Correlate fail maps to repair signatures
Audit in-field boot test budget
Ask: what evidence proves this DFT decision is safe for production?
State metric, lot/corner context, and pattern tag with every claim.
Treat timing, power, and quality as one signoff problem.
Chasing coverage without legality checks.
Ignoring test-power side effects of pattern changes.
Debugging silicon without reproducible tags.
Redundancy analysis maps diagnosed memory defects to spare rows/columns, trading area overhead for yield recovery.
Metric: repairable fail ratio, spare utilization, post-repair yield uplift
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