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Course contents

  • How to Use This Course
  • The NanoSoC Tour
  • Reading Path
  • SoC Glossary10
  • SoC Metrics Reference
  • SoC Cheatsheet
  • What SoC Integration Is12
  • Architecture and Budgets21
  • Memory Maps and Address Decode26
  • Interconnect and Bus Fabrics26
  • Clock and Reset Architecture24
  • Power Architecture21
  • Interrupts, DMA and Peripherals15
  • Memories, Boot and Security21
  • IP Integration and Handoff21
  • Top-Level Verification and Bring-up21
    • SoC Verification Strategy
    • Integration and Connectivity Tests
    • Firmware Co-Simulation
    • Performance Verification
    • Gate-Level and Power-Aware Simulation
    • Emulation and FPGA Prototyping
    • Bring-Up Readiness
      • The Boot Timeline the Lab Will Expect
      • Debug Access and Observability
      • Test Plan, Lab Setup and the Readiness Checklist
  • Package, Pads and I/O18
  • Chip Signoff and Tapeout18
  • SoC Interview Prep16
  • Capstone: Integrate NanoSoC14
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←Top-Level Verification and Bring-up
  1. Topics
  2. SoC Design
  3. Top-Level Verification and Bring-up
  4. Bring-Up Readiness

Part 10 of 14Part 10 of 14/Top-Level Verification and Bring-upAll levels

Bring-Up Readiness

What must exist before first silicon: the expected boot timeline, the debug access the chip really has, the test plan, the lab, and a go or no-go checklist.

  • 3topics
  • 3lessons

First silicon arrives once. The day it does, the lab can see a handful of pins and whatever the boot ROM prints (on NanoSoC v1 that is the banner and nothing else), and the ROM cannot be changed. Everything that would have made that day productive has to exist months earlier: a timeline of what the pins should do, a way in when the CPU is stuck, a test plan in an order that isolates faults, a bench that matches the board (two supply rails, the pad pulls), and evidence that each earlier topic of this section actually ran. This topic is the pre-silicon readiness review for NanoSoC. For the bring-up flow itself, the day-zero checklist and the debug of silicon failures, follow the links to the Bring-up and Hardware Debug courses; this topic is the integrator's side of the hand-off. The ten planted bugs and the three pad bugs it uses are listed in the NanoSoC tour.

Lesson

After it you can...

The Boot Timeline the Lab Will Expect

Write the pin-level timeline of a good boot and check the UART setting against the host.

Debug Access and Observability

State what the lab can observe on NanoSoC, map a silent pin to a boot stage, and find the gaps.

Test Plan, Lab Setup and the Readiness Checklist

Order the first-day tests, set up the bench, and run a go or no-go review that blocks on open items.

Suggested order: top to bottom. The timeline first, because every later check is a comparison against it; then what can be observed when the timeline is not met; then the plan, the bench and the checklist that turn the evidence of the whole section into a decision.

Check yourself Why is the boot ROM the centre of the readiness review?

It is the first code that runs, it prints the only text the lab sees (the banner), and it is read-only: a flaw in it cannot be patched and may need a mask change. Its content must be verified on RTL, gate-level and a prototype before tape-out.

Expect: what must be ready before first silicon? Answer in four groups: the boot path simulated end to end, a way to see inside when it fails, a test plan that orders the faults, and a bench plus a checklist with a go or no-go rule.

Related topics

  • NanoSoC Tour

  • Memories and Boot: Boot ROM and Boot Modes

  • IP Integration: Debug Infrastructure

  • Package and Pads: Test and Debug Pins

  • Chip Signoff: Tapeout Readiness Review

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See also

  • SoC Verification Strategy
  • Integration and Connectivity Tests
  • Firmware Co-Simulation