Review checklist

Review Checklist for Test Power & IR focuses on peak test-mode current, IR drop hotspots, scan-induced thermal spikes. The goal is to convert metric movement into mechanism, owner, and release decision.

• Run tags and scenario context are explicit.

• Constraints and legality assumptions are documented.

• Quality, timing, and test-power checks are included.

• Diagnosis evidence supports residual-risk decision.

• Owners signed: power signoff owner, ATPG owner, DFT lead.

Signoff ownership

OWNERSHIP MAP - Test Power & IR

artifact              owner
----------------      -----------------
architecture/report power signoff owner
constraints/setup   ATPG owner
physical/test       DFT lead

Name an owner for each failing metric cluster.

DFT deep dive

Test signoff fails when shift/capture timing and test power are treated independently.

Concept diagram

TEST SIGNOFF LOOP

test SDC -> shift/capture timing -> power-aware ATPG -> IR validation -> release

Metric graph

TEST CURRENT

functional current  baseline
scan shift current  peak-risk zone

Reports and artifacts

• test-mode STA report

• shift/capture split

• test power IR map

• waiver tracker

Mini case study

At-speed patterns passed timing but failed in production due to peak shift IR; staggered capture and power-aware fill resolved.

Debug branches

• Tag test and functional corners separately

• Check hold in shift mode

• Correlate fail bins with power hotspots

Senior review question

Ask: what evidence proves this DFT decision is safe for production?

Key takeaways

• State metric, lot/corner context, and pattern tag with every claim.

• Treat timing, power, and quality as one signoff problem.

Common pitfalls

• Chasing coverage without legality checks.

• Ignoring test-power side effects of pattern changes.

• Debugging silicon without reproducible tags.

Principal DFT review addendum

Scan activity can exceed functional switching, so pattern scheduling and power-aware ATPG are needed to avoid IR and thermal escapes.

Metric: peak test-mode current, IR drop hotspots, scan-induced thermal spikes