DFT / ATPG · All levels
Test Power & IR: Step-by-Step Walkthrough
Step-by-Step Walkthrough for Test Power & IR.
Step-by-step analysis walkthrough
Use when you own Test Power & IR in a DFT closure review.
Open release criteria and failing metric dashboard.
Partition failures by pattern family and operating context.
Inspect constraints, clocks, masks, and unknown handling.
Check architecture assumptions against implementation reality.
Review diagnosis evidence for repeatability.
Assign owner and propose smallest high-confidence change.
Run timing, power, and quality regressions.
Capture final signoff or waiver decision.
Artifacts to collect
test power report, IR map, power-aware ATPG settings log
pattern tag manifest
tester program revision
signoff checklist
owner tracker
Decision memo template
DFT DECISION MEMO - Test Power & IR
scenario:
metric:
hypothesis:
fix:
regression:
owners: power signoff owner, ATPG owner, DFT leadReference visuals
Scan power stress
scan toggling burst -> peak current -> IR droop / thermal rise
Mitigation: power-aware ATPG + pattern scheduling + capture staggeringDFT deep dive
Test signoff fails when shift/capture timing and test power are treated independently.
Concept diagram
TEST SIGNOFF LOOP
test SDC -> shift/capture timing -> power-aware ATPG -> IR validation -> releaseMetric graph
TEST CURRENT
functional current baseline
scan shift current peak-risk zoneReports and artifacts
test-mode STA report
shift/capture split
test power IR map
waiver tracker
Mini case study
At-speed patterns passed timing but failed in production due to peak shift IR; staggered capture and power-aware fill resolved.
Debug branches
Tag test and functional corners separately
Check hold in shift mode
Correlate fail bins with power hotspots
Senior review question
Ask: what evidence proves this DFT decision is safe for production?
Key takeaways
State metric, lot/corner context, and pattern tag with every claim.
Treat timing, power, and quality as one signoff problem.
Common pitfalls
Chasing coverage without legality checks.
Ignoring test-power side effects of pattern changes.
Debugging silicon without reproducible tags.
Principal DFT review addendum
Scan activity can exceed functional switching, so pattern scheduling and power-aware ATPG are needed to avoid IR and thermal escapes.
Metric: peak test-mode current, IR drop hotspots, scan-induced thermal spikes