Mechanism to understand

Mechanism for Test Power & IR focuses on peak test-mode current, IR drop hotspots, scan-induced thermal spikes. The goal is to convert metric movement into mechanism, owner, and release decision.

Scan activity can exceed functional switching, so pattern scheduling and power-aware ATPG are needed to avoid IR and thermal escapes. Think of DFT as a quality pipeline where setup quality determines what silicon evidence means.

• Identify where controllability/observability is introduced.

• Identify legal constraints and mode assumptions.

• Identify failure class: architecture, constraints, physical, or silicon.

Layered view

DFT CLOSURE FLOW - Test Power & IR

scan/test architecture
        |
        v
ATPG constraints + fault models
        |
        v
pattern generation + compression
        |
        v
timing/power/physical validation
        |
        v
silicon diagnosis and release signoff

Debug rule: always state metric, run tags, and owning team with any claim.

Scan power stress

scan toggling burst -> peak current -> IR droop / thermal rise

Mitigation: power-aware ATPG + pattern scheduling + capture staggering

Layer responsibilities

DFT OWNERSHIP LAYERS - Test Power & IR

layer              owns                         failure mode
----------------   --------------------------   -------------------------
rtl/architecture   scanability hooks            uncontrollable logic
atpg/constraints   legal pattern intent         aborts, low coverage
physical/clocking  chain route + test clocks    shift hold/timing escapes
tester/program     pattern apply integrity      false binning / bad fails
quality signoff    release criteria             escapes or schedule slip

DFT deep dive

Test signoff fails when shift/capture timing and test power are treated independently.

Concept diagram

TEST SIGNOFF LOOP

test SDC -> shift/capture timing -> power-aware ATPG -> IR validation -> release

Metric graph

TEST CURRENT

functional current  baseline
scan shift current  peak-risk zone

Reports and artifacts

• test-mode STA report

• shift/capture split

• test power IR map

• waiver tracker

Mini case study

At-speed patterns passed timing but failed in production due to peak shift IR; staggered capture and power-aware fill resolved.

Debug branches

• Tag test and functional corners separately

• Check hold in shift mode

• Correlate fail bins with power hotspots

Senior review question

Ask: what evidence proves this DFT decision is safe for production?

Key takeaways

• State metric, lot/corner context, and pattern tag with every claim.

• Treat timing, power, and quality as one signoff problem.

Common pitfalls

• Chasing coverage without legality checks.

• Ignoring test-power side effects of pattern changes.

• Debugging silicon without reproducible tags.

Mechanism deep dive

Scan activity can exceed functional switching, so pattern scheduling and power-aware ATPG are needed to avoid IR and thermal escapes.