Test-mode IR and thermal behavior dominate production stability.
compression logic footprint
hold buffers from scan paths
shift toggling peaks
capture burst stress
test-clock skew
shift/capture path sensitivity
chain route detours
placement hotspots near test logic
pattern replay correlation
diagnosis reproducibility
SILICON IMPACT - Test-Mode SDC
area/power/timing/yield tradeoffSignoff needs silicon evidence
Ownership clarity accelerates closure
CHAIN BALANCE - Test-Mode SDC
chain length
^
| o o
| o o o
| o
+-----------------------------> chain index
Tight spread reduces shift time and hold-fix burden.Test signoff fails when shift/capture timing and test power are treated independently.
TEST SIGNOFF LOOP
test SDC -> shift/capture timing -> power-aware ATPG -> IR validation -> releaseTEST CURRENT
functional current baseline
scan shift current peak-risk zonetest-mode STA report
shift/capture split
test power IR map
waiver tracker
At-speed patterns passed timing but failed in production due to peak shift IR; staggered capture and power-aware fill resolved.
Tag test and functional corners separately
Check hold in shift mode
Correlate fail bins with power hotspots
Ask: what evidence proves this DFT decision is safe for production?
State metric, lot/corner context, and pattern tag with every claim.
Treat timing, power, and quality as one signoff problem.
Chasing coverage without legality checks.
Ignoring test-power side effects of pattern changes.
Debugging silicon without reproducible tags.
Dedicated test SDC captures scan clocks, test enables, and exceptions needed to analyze shift and capture behavior correctly.
Metric: test SDC completeness, false test-path violations, test constraint audit score
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